JPH0435915B2 - - Google Patents

Info

Publication number
JPH0435915B2
JPH0435915B2 JP62015015A JP1501587A JPH0435915B2 JP H0435915 B2 JPH0435915 B2 JP H0435915B2 JP 62015015 A JP62015015 A JP 62015015A JP 1501587 A JP1501587 A JP 1501587A JP H0435915 B2 JPH0435915 B2 JP H0435915B2
Authority
JP
Japan
Prior art keywords
mold
cavity
printed circuit
pattern
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62015015A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63182890A (ja
Inventor
Teruo Tanigawa
Hironori Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP1501587A priority Critical patent/JPS63182890A/ja
Publication of JPS63182890A publication Critical patent/JPS63182890A/ja
Publication of JPH0435915B2 publication Critical patent/JPH0435915B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1501587A 1987-01-23 1987-01-23 プリント回路基板の射出成形方法 Granted JPS63182890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1501587A JPS63182890A (ja) 1987-01-23 1987-01-23 プリント回路基板の射出成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1501587A JPS63182890A (ja) 1987-01-23 1987-01-23 プリント回路基板の射出成形方法

Publications (2)

Publication Number Publication Date
JPS63182890A JPS63182890A (ja) 1988-07-28
JPH0435915B2 true JPH0435915B2 (en]) 1992-06-12

Family

ID=11877047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1501587A Granted JPS63182890A (ja) 1987-01-23 1987-01-23 プリント回路基板の射出成形方法

Country Status (1)

Country Link
JP (1) JPS63182890A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4142954B2 (ja) * 2003-01-10 2008-09-03 京セラ株式会社 プリント配線板の製造装置
JP4809681B2 (ja) * 2006-01-26 2011-11-09 日東技研株式会社 静電容量型タッチパネル

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547477B2 (en]) * 1972-06-24 1980-11-29

Also Published As

Publication number Publication date
JPS63182890A (ja) 1988-07-28

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